Product promotion for surface packaging of electronic parts

From August 28 to August 30, 2018, he participated in the exhibition held by Nepcon in Shenzhen. Nepcon is an exhibition with SMT (surface packaging technology) and EMA (electronic manufacturing automation) as the center.

Nepcon South China held in Shenzhen has 51228 visitors and 45000 square meters of booth area, which is the largest exhibition of this year.

Our company shows UV hardening, heat hardening products, adhesives and metal cutting, among which UV hardening products negotiate relatively more. In addition to attracting customers, we can also feel the market's attention to UV hardening. We will make effective use of the relevant information from this exhibition.